Course
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Module
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Operator
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Maintenance
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Process
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| The outline of the device |
| (1) |
The outline of the device |
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Know the Device Name, Type, Layout, Each part's Name |
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Know the Structure of the Device (Optional) |
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Check the Utilities of the Device |
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| Operation |
| (1) |
Auto-Operation by Operation Panel |
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Enter / Deliver the Cassettes |
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Execute the Process Recipe |
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Execute the Recipe for Process Parameter change (Optional) |
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| (2) |
Collect the Process Data (Optional) |
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Make use of Logging function (Optional) |
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Make use of Trend function (Optional) |
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| Process Recipe change |
| (1) |
Input the Process Recipe |
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Know the configuration of the Recipe |
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Create / Save the Recipe File |
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Input the Recipe Step |
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Add the Recipe Step |
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Connect the Recipe Condition |
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Register the Recipe Parameter (Optional) |
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| (2) |
Change the Temperature Condition |
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Change the Temperature condition |
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| (3) |
Change the Abnormality Transaction Setting |
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Change the Alarm Transaction setting |
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Change the Abort Transaction setting |
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| (4) |
Create the System Recipe (Optional) |
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Set the common step into System Recipe |
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Set the Alarm Transaction into System Recipe |
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| Maintenance |
| (1) |
Performing Basic Operation of Handy Terminal |
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The configuration of Transfer system |
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Basic operation of Handy Terminal |
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| (2) |
Teach the boat side position after change the boat |
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Enter / Deliver the cassettes to / from the rack |
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Transfer the wafer in front of the boat |
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Adjust the wafer position in the boat |
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Write / Check the position value |
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| (3) |
Install / Remove the Quartz ware |
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Install / Remove the Quartz tube (CVD) |
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Install / Remove the Quartz tube (Diffusion) |
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| (4) |
Preparation for Maintenance by Manual Operation |
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Initialize the axes |
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Switch to Manual Operation Mode |
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Boat load / Unload by Manual Operation |
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Ramp-up / down in the reaction chamber by Manual Operation |
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N2-purge in the reaction chamber by Manual Operation |
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| (5) |
Check the leak rate of the reaction chamber |
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Exhaust / N2－purge in the reaction chamber |
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Execute the leak －check operation |
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Repair the leak |
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| (6) |
Collect the Temperature Profile |
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Install the Profile T/C |
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Collect the Temperature Profile |
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Parameter Change
(Optional) |
| (1) |
Change the Wafer/Cassette Parameter |
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Change the Wafer Arrangement Parameter |
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Change the Cassette Assignment Parameter |
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Troubleshooting
(Optional) |
| (1) |
Transaction after stopping the Transfer System |
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Check the obstacles information |
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Transfer the Wafer by Semi-Auto/Single Command |
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Resume the Wafer Transfer after stopping |
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