Hitachi kokusai Electric Inc.:200mm Vertical Diffusion/LPCVD Systems

VERTRON-III(F3) DD-823V/DJ-823V

VERTRON-III(J3) DD-853V/DJ-853V

VERTRON-III(G) DD-833V/DJ-833V

Hitachi Kokusai Electric's Vertron-III series Vertical Diffusion/LPCVD systems have been developed especially for 200mm wafers which are predominantly used in high-volume-semiconductor device manufacturing. The Vertron-III platform offers solid reliability and provides superior cost of ownership (Co0)to our customers.

The Vertron-III offers all conventional films as well as the unique processes of BTBAS Si3N4, and Selective SiGe epitaxy. Hitachi Kokusai is recognized as a leader in thermal solutions and customer satisfaction.

Phot(200mm Vertical Diffusion/LPCVD Systems)

Specifications

	VERTRON-III(F3)	VERTRON-III(J3)	VERTRON-III(G)
Wafer Diameter(mm)	200	200	200
Wafer Batch Size	150	150	125
Standard Mechanical Interface (SMIF)	YES	NO	NO
Number of Cassette Racks	21	22	12 (Max 16)
Number of Cassette I/O	2	2	2
Tube Controller	CX-3000 (Color TFT)	CX-3000 (Color TFT)	CX-3000 (Color TFT)
Dimensions(W×D×H)(mm)	900×2210×3150	900×1900×3150	900×1965×2800

Process Applications

Dry-Ox, Wet-Ox, NO(N2O)-Anneal, Well Diffusion, N2(Ar, H2)-Anneal, PH3-Anneal, Doped/Undoped-Poly-Si, Doped/Undoped-SiGe-Poly, Si3N4, TEOS, HTO

Main Features

High throughput by providing large batch size (150 for F3 and J3 type, 125 for G type)
High throughput by optional fast ramp heater element while maintaining low thermal budget.
Excellent yield and film thickness uniformity by optimized process conditions and clean air flow in loading area of the system.
Maximum system uptime by self-cleaning capability.
Minimum overhead time by reliable and speedy wafer handling mechanisms. Wafer handling robot can transfers 5 wafers simultaneously.
High speed, reliable and low vibration cassette loading mechanisms.
Automatic filler dummy wafer supply by wafer detection mechanism.
SEMI standard compliant wafer I/O stage
Supports SMIF interface
Effective space utilization of side-by side layout by side access free design
User friendly GUI tube controller (CX3000 series) which supports process logging data analysis capability.
SECS/GEM compatibility for factory automation.

Typical Process Performance

Film Type		Poly	D-Poly	Thick- SiN	Thin- SiN	TEOS	HTO	Dry-Ox	Thick- Pyro	Thin- Pyro
Film Thickness(nm)		100	100	100	5	100	100	10	400	3
P-Concentration(cm^-3)		-	4E20	-	-	-	-	-	-	-
Deposition Rate(nm/min)		> 7	> 1.5	> 1.5	> 0.2	> 4	> 1.5	-	-	-
Uniformity of Film Thickness	Within Wafer	<2%	<2%	<2%	<2%	<3%	<3%	<1.5%	<2%	<2%
	Wafer to Wafer	<2%	<2%	<2%	<2%	<2%	<2.5%	<1.5%	<1.5%	<1.5%
	Batch to Batch	<1%	<1%	<1%	<1%	<1%	<1%	<1%	<1%	<1%
Particles/8"Wafer(>0.2m)		< 30	< 30	< 30	< 30	< 30	< 30	< 10	< 10	< 10
Metal Contamination(cm^-3)		< 1 × 10¹⁰

Note : For film types not described above, please contact us.

* VERTRON is a registered trademark of Hitachi Kokusai Electric Inc.