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Batch Processing System

Hitachi Kokusai's unique thermal technologies enable its batch processing systems to offer the lowest cycle time with the largest batch size and highest process performance

  • QUIXACE Batch Thermal Process System for 300mm Wafers

    • QUIXACE is Hitachi Kokusai's latest platform for batch thermal processing of 300 mm wafers. The QUIXACE offers high throughput by utilizing advanced technologies in such areas as temperature control, wafer handling automation, reactor purging, and temperature ramping. Hitachi Kokusai Electric is proud to offer QUIXACE, the leading platform for today's manufacturing environment which offers both flexibility and extendibility to meet tomorrow's challenges.

  • Advanced Batch Thermal Process Technology

    • Hitachi Kokusai Electric is proud to introduce Balance Controlled Deposition (BCD) which is a novel, next generation deposition technique available on the QUIXACE platform. QUIXACE is Hitachi Kokusai's main tool platform for large batch thermal processing and it has been widely used by many IC manufacturers and for a wide variety of process applications. The BCD technique provides lower temperature processing and tighter process control for advanced small geometry devices while maintaining very high productivity, which can benefit a wide range of users and process applications.

  • Batch High Temperature Anneal Processing System

    • This tool offers the best manufacturing solution for high-quality silicon substrate fabrication and high temperature device manufacturing processes. 1350℃ is a typical temperature for high temperature annealing processes. Crystalline slip lines are easily induced on 300mm wafers processed at such high temperatures. This tool produces slip-free wafers at very high throughputs.

  • Batch SiGe/Si Epitaxial Growth System

    • Hitachi Kokusai's new batch epitaxial system offers a cost-effective solution to SiGe/Si community. Employing a field-proven vacuum load lock platform, this tool produces a high crystalline quality epitaxial film which meets advanced device requirements while maintaining high throughput and low cost of ownership.

  • VERTRON Batch Thermal Process System for 200mm Wafers

    • Hitachi Kokusai's Vertron-III series Batch Diffusion/LPCVD systems have been developed specifically for processing 200mm wafers predominantly used in high-volume semiconductor device manufacturing. The Vertron-III platform offers solid reliability and superior cost of ownership (CoO).